Talks & Lectures

Two Studies on 3D ICs: TSV-to-TSV coupling analysis and design methodologies for low-power 3D ICs – Seoul, South Korea  Aug 13, 2014
– Seminar
– SDT Team, System IC R&D Lab, CTO, LG Electronics Inc.

Two Studies on 3D ICs: TSV-to-TSV coupling analysis and design methodologies for low-power 3D ICs – Hwasung, South Korea  May 7, 2014
– Seminar
– Design Technology Team, System LSI Business, Samsung Electronics Co., Ltd,

ECE 2020 Fundamentals of Digital Design – Atlanta, GA  Fall, 2013
– Assistant Instructor (Instructor: Prof. Sung Kyu Lim)
– Georgia Institute of Technology

ECE 4754 Electronics Packaging Assembly, Reliability, Thermal Management, and Test – Atlanta, GA  Mar. 28, 2013
– Guest Lecturer (Instructor: Prof. Rao Tummala)
– Georgia Institute of Technology

ECE 2020 Fundamentals of Digital Design – Atlanta, GA  Spring, 2013
– Assistant Instructor (Instructor: Prof. Sung Kyu Lim)
Georgia Institute of Technology

 The Theory & Design for RF Board (SI design/EMI) – Seoul, Korea July 7, 2010 – July 9, 2010
– Lecturer
– KAIST EMDEC

The Theory & Design for RF Board (SI design/EMI) – Seoul, Korea Mar. 3, 2010 – Mar. 5, 2010
– Lecturer
– KAIST EMDEC

Signal Integrity, Measurement and Practice – Suwon, Korea Apr. 9, 2009
– Lecturer
– Samsung Advanced Technology Training Institute

 

Print Friendly

Leave a Reply

Your email address will not be published. Required fields are marked *